- Unique TCC (Thermal Conductive Coating), to create better velocity of thermal transferring and to prevent oxidation on surface. - Patented VGF (Vortex generator flow), to increase air convection in-between the fins. - Patented SEF (Stack Effect), to enhance heat transferring bottom up. - VEF (Vacuum Effect), to optimize airflow inside the cooler.
Cooler Master Horizontal Vapor Chamber Technology – minimizes CPU hotspots and spreads heat evenly to all heatpipes. Triple Tower Heatsink with 8 High Performance Heatpipes – Optimized for maximum cooling performance. Dual High airflow PWM fans with red LEDs. Fan speed and resulting performance and noise can be fine tuned and customized. POM Bearing –...
PRODUCTO NUEVO SIN CAJA - Ultimate Overclocking Thermal Structure Design, support up to 240W. - Integrated Module for Dual 130mm VR™ OC Fan and the dazzling Cover. - Universal Socket Compatibility & Accessory Package.